Bonding Method

· DAF , Silver-filled epoxy paste

Bonding Accuracy

· X,Y : ± 25㎛ , θ : ± 0.1 °

UPH

· 7K(not included B'g time)

Bonding Force

· 5N ~ 30N

Wafer Mapping

· Depend wafer mapping file SECS, Floppy Disk, LAN

Operating System

· MS-Window 7

Control Type

· FA Computer

MMI Interface

· TFT - LCD 17" Touch Screen OP Panel

Conversion Kit

· Wafer 8" Kit

Conversion Kit

· Wafer 12" Kit

Utility

· Dry Air : Over 400 kpa

· Vacuum Source : Less -75kpa

· Power Source : AC 220V ± 2% , 3 Phase , 50/60Hz

Temperature

· 20 +-3 C

Enviroment

· 10000 Class

Color

· White as standard

Machine Cover

· Full cover

Machine Dimension

· 1,950(W) * 1,450(D) * 1,650(H)

Weight

· Approx. 2,000kg